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	FUJI innovative spirit FUJI CORPORATION UK00801049657	Registered	Placers, mounters and inserters of electronic component for manufactur... Class 007 Class 007 Machinery Products Placers, mounters and inserters of electronic component for manufacturing and assembling printed circuit boards; electronic component inserters; screen printers for manufacturing and assembling printed circuit boards; dispensers for manufacturing and assembling printed circuit boards; adhesive curing machines for assembling printed circuit boards; soldering machines used for manufacturing and assembling printed circuit boards; feeders of printed circuit boards; parts of machines exclusively used for provisional storing printed circuit board in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards for semiconductor manufacturing machines and systems; reversing machines used for manufacturing and assembling printed circuit boards; rotating machines used for manufacturing and assembling printed circuit boards; buffers for printed circuit boards for semiconductor manufacturing machines and systems; loaders and unloaders for manufacturing and assembling printed circuit boards for semiconductor manufacturing machines and systems; tape cartridges for electronic component placers, mounters and inserters for semiconductor manufacturing machines and systems; electronic component feeders for semiconductor manufacturing machines and systems; semiconductor manufacturing machines and systems; apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component optical lens, and automobile component (not of metal); apparatus for removing oxide film using plasma and used in processing semiconductor substrate, and in a manufacturing process of semiconductor devices, electronic component for automobile, and other semiconductor device and electronic component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof; automatic assembling equipments for small-sized parts and fittings; automatic assembling equipments for fuel cells, solar cells and other secondary cells; automatic assembling equipments for telecommunication machines; automatic assembling equipments for electronic machines; automatic assembling equipments for photographic machines; automatic assembling equipments for cinematographic machines; automatic assembling equipments for optical machines; automatic assembling equipments for electronic circuit boards; automatic assembling equipments for electronic circuits; automatic assembling equipments for game machines; automatic assembling equipments for AC and DC motors; automatic assembling equipments for power distribution or control machines; automatic assembling equipments for metalworking machines; automatic assembling equipments for medical machines.

Registered

FUJI innovative spirit

FUJI CORPORATION

007

Class 007

Machinery Products

Placers, mounters and inserters of electronic component for manufacturing and assembling printed circuit boards; electronic component inserters; screen printers for manufacturing and assembling printed circuit boards; dispensers for manufacturing and assembling printed circuit boards; adhesive curing machines for assembling printed circuit boards; soldering machines used for manufacturing and assembling printed circuit boards; feeders of printed circuit boards; parts of machines exclusively used for provisional storing printed circuit board in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards for semiconductor manufacturing machines and systems; reversing machines used for manufacturing and assembling printed circuit boards; rotating machines used for manufacturing and assembling printed circuit boards; buffers for printed circuit boards for semiconductor manufacturing machines and systems; loaders and unloaders for manufacturing and assembling printed circuit boards for semiconductor manufacturing machines and systems; tape cartridges for electronic component placers, mounters and inserters for semiconductor manufacturing machines and systems; electronic component feeders for semiconductor manufacturing machines and systems; semiconductor manufacturing machines and systems; apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component (not of metal) formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component optical lens, and automobile component (not of metal); apparatus for removing oxide film using plasma and used in processing semiconductor substrate, and in a manufacturing process of semiconductor devices, electronic component for automobile, and other semiconductor device and electronic component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof; automatic assembling equipments for small-sized parts and fittings; automatic assembling equipments for fuel cells, solar cells and other secondary cells; automatic assembling equipments for telecommunication machines; automatic assembling equipments for electronic machines; automatic assembling equipments for photographic machines; automatic assembling equipments for cinematographic machines; automatic assembling equipments for optical machines; automatic assembling equipments for electronic circuit boards; automatic assembling equipments for electronic circuits; automatic assembling equipments for game machines; automatic assembling equipments for AC and DC motors; automatic assembling equipments for power distribution or control machines; automatic assembling equipments for metalworking machines; automatic assembling equipments for medical machines.

Placers, mounters and inserters of electronic component for manufactur...

Owners

Fuji corporation (1)

Categories

Class 7 (1)

Attorney

Sipara limited (1)

Correspondents

Rochester house (1)

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