Robots; Pumps, compressors and fans; Engines, powertrains, and generic machine parts; Machines and machine tools for treatment of materials and for manufacturing; Power operated valves; Valves [parts of machines]; Actuators for valves; Valves [parts of machines]; Valves (Clack -) [parts of machines]; Valves (Clack -) [parts of machines]; Lockable valves [parts of machines]; Valves (Clack -) [parts of machines]; Valves for pumps.

Electric valves [thermionic]; Apparatus, instruments and cables for electricity; Safety, security, protection and signalling devices; Measuring, detecting and monitoring instruments, indicators and controllers; Electric and electronic components; Controllers (regulators); Monitoring instruments; Electricity indicators; Measuring, counting, alignment and calibrating instruments; Sensors and detectors; Software; Gasometers [measuring instruments]; Gas sensors; these goods are intended for industrial purposes.

Servo motors for sewing machines;Industrial sewing machines;Sewing machines for household purposes;Ironing machines and laundry presses;Steam boilers [parts of machines].

Machines and machine tools, parts and spare parts thereof as far as included in class 7; machines, parts and turnkey production installations for manufacturing plastic carts and smart cards, in particular chip cards, contact-less cards, dual interface cards and smart media/multimedia cards; machines, parts and turnkey production installations for manufacturing RFID labels and smart labels, for manufacturing RFID inlays, and smart labels, in particular labels for contact-less data transfer; machines, parts and turnkey production installations for manufacturing passports an electronic passports, including machines, parts and turnkey production installations for manufacturing holder pages for passports, booklets for passports, machines and turnkey production installations for qualification of passport booklets, and machines and turnkey production installations for personalization of electronic passports (ePassport); machines, parts and turnkey production installations for handling and manufacturing semiconductor components from the semiconductor backend sector, such as semiconductor chips, transistors, or other semiconductor devices including light diodes; including machines, parts and turnkey production installations for picking up semiconductor dies from a wafer and placing the dies into carriers eg carrier tapes, waffle packs, jedec trays, film frames, glass tools, lead frame; machines, parts and turnkey production installations for manufacturing precision parts and packaging straps for the electrical industry machines and turnkey production installations for sheet metal forming, welding, precision machining, CNC milling, eroding, grinding, surface treatment, and system assembly; machines, parts and turnkey production installations including labeling stations for a production or marking line, scan stations for reading one-dimensional or two-dimensional codes in a production line, automatic incoming goods system to record supplier labels on component rolls, dry packs, rods and cardboard boxes, laser marking systems for marking different materials according to customer requirements; machines, parts and turnkey production installations including stations for dispensing and encapsulation, assembling, UV-curing and integrated circuit or board module testing; machines, parts and turnkey production installations including stations for testing, contacting, and labelling solar cells, modules and panels; machines, parts and turnkey production installations for manufacturing rigid and flexible solar cells, modules and panels, including reel-to-reel backend equipment for flexible non sticky solar cells on foil substrate, reel-to-reel backend equipment for flexible self sticky solar cells on foil substrate, turnkey production installations of reel-to-reel backend equipment for flexible pre-laminate manufacturing, lamination, testing, sorting and packaging, and reel-to-reel backend equipment for flexible pre-laminate manufacturing, lamination, testing, sorting and packaging of glass panels; machines, parts and turnkey production installations for automated manufacturing and handling of printed circuit boards (PCBs), including buffer systems for PCBs or substrates, buffers, including buffers for rejecting bad PCBs or substrates after a test system, buffer modules with integrated magazines, traffic control systems used in a production line in order to change the flow of the PCBs or substrates; transport units serving as interim buffering and transfer of PCBs or substrates in a production line; loaders and unloaders of PCBs or substrates in a production line used for the automatic loading and unloading of PCBs or substrates in a in a production line or pick and place machine, screen printers, continuous furnaces, test systems from or onto a PCB stack; machines, parts and turnkey installations for border and access control, including machines, parts and turnkey installations for high speed, multi-biometric verification of individuals; machines, parts and turnkey installations for automatically, electronically and optically checking personal identification documents as to completeness, validity, correctness and holder authenticity; and machines, parts and turnkey installations for video surveillance including online video surveillance; machines, parts and turnkey installations for card quality control and card mailing; automatic vending machines.

Scientific optical, weighing, measuring, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electrical signals and power; apparatus for recording, transmission or reproduction of data, sound or images; solid state, and magnetic data carriers, recording discs;  mechanisms for coin-operated apparatus; cash registers, calculating machines, data processing equipment and computers; smartcards, in particular chip cards, contact-less cards, dual interface cards and smart media/multimedia cards; smart labels, in particular labels for contact-less data transfer; semiconductor components from the semiconductor backend sector, including light diodes; magnetic media; data-processing equipment and computers; thin film solar cells, thin film solar modules, solar panels; computer hardware and electronic modules for industrial machine vision including machine vision apparatus for surface and print inspection in the fields of packaging industry, security printing and minting and metal working.