NaNoS

Class [40]
Treatment & Processing of Materials Services

Custom additive manufacturing for others, Manufacture of hi-performance electronic devices for others, namely, custom-designed printed circuit boards, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), interposers - fabricated using 3D printers; Manufacturing services for others in the field of hi-performance electronic devices (HI-PED), namely, system-in-package (SiP) electronics, micro electromechanical systems (MEMS), inertial MEMS, substrate-embedded systems, planar magnetic boards, mesh communication electronics, mmWave RF antennae PCB, antennae-in-chip (AiC), antennae-in-package (AiP), substrate-like PCB (SLP), Fan-in/Fan-out AiP (InFO-AiP), Package-in-package (PiP) electronics, integrated photonic devices, through Silicone via (TSV) devices, embedded multi-die interconnect bridge (EMIB) chips, monolithic microwave integrated circuits (MMIC), and interposers.